doc. no : qw0905- rev. : date : 22 - jun - 2005 a lvg3331/h0 super bright round type led lamps data sheet lvg3331/h0 ligitek electronics co.,ltd. property of ligitek only
25% 100% 50% 75% -60 x 50% 0 25% 75% 100% 60 x note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -30 x directivity radiation 0 x 30 x package dimensions 7.6 8.6 1.5max ?? 0.5 typ 25.0min 1.0min 2.54typ 5.0 5.9 ligitek electronics co.,ltd. property of ligitek only lvg3331/h0 part no. 1/4 page
note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. absolute maximum ratings at ta=25 j typical electrical & optical characteristics (ta=25 j ) lvg3331/h0 gap green transparent green material part no emitted lens color pd power dissipation tstg storage temperature soldering temperature tsol reverse current @5v operating temperature t opr ir peak forward current duty 1/10@10khz forward current i fp i f parameter symbol part no. lvg3331/h0 viewing angle 2 c 1/2 (deg) 565 30 1.7 2.6 160 300 38 forward voltage @ ma(v) peak wave length f pnm spectral halfwidth ??f nm 20 min. luminous intensity @20ma(mcd) max. min. typ. mw 100 -40 ~ +100 j max 260 j for 5 sec max (2mm from body) -40 ~ +85 10 j g a 120 30 ma ma ratings vg unit 2/4 ligitek electronics co.,ltd. property of ligitek only page
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 page 3/4 part no. lvg3331/h0
the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. thermal shock test 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. solderability test solder resistance test this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. high temperature storage test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs high temperature high humidity test low temperature storage test the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) operating life test test item this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. description reference standard ligitek electronics co.,ltd. property of ligitek only part no. lvg3331/h0 4/4 page
|
